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• Features

Minimum connecting area of bump: 1500 μm2.
High reliability and stable adhesion property on FR4 & Ceramic

Characteristics
Item TFA220 Series
Pitch size Line ㎛ (㎛2) 1500㎛2
Space 15
Conductiveparticle Type -
Size 3/5
Density pcs/㎜2 40000/4500
Main-bonding condition Temp. 180±10
Time sec. ≥15
Pressure MPa 40~100 (per bump area of IC)