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COG

• Features

Fine pitch interconnection : min. 6㎛ gap for COG application Minimum connecting area of bump: 800㎛2.
High reliability and adhesion property.

Characteristics
Item TCG1031/41 Series TCG9031/41 Series
Pitch size Line ㎛ (㎛2) 1200㎛2 800㎛2
Space 10 6
Conductiveparticle Type - Au/Ni/polymer or Ni/Polymer
Size  3/4
Density pcs/㎜2 45000 60000
Main-bonding condition Temp. 210±20 155±20
Time sec. ≥5
Pressure MPa 3~540~100 (per bump area of IC)