• Features- High adhesion for COF&FPC- Good contact resistance for reliability - Good for wide bonding temp. range |
Item | TGP20500 Series | TGP5000 Series | EMA8888 Series | ||
---|---|---|---|---|---|
Pitch size | Line | ㎛ | 50 | ||
Space | ㎛ | 50 | |||
Conductiveparticle | Type | - | Ni | ||
Size | ㎛ | 3/5 | 5 | 3 | |
Density | pcs/㎜2 | 10000/1500 | 7500 | 10000 | |
Main-bonding condition | Temp. | ℃ | 190±10 | 170±30 | 160±30 |
Time | sec. | ≥8 | ≥4 | ≥4 | |
Pressure | MPa | 3~5 | 2~5 |