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COF

• Features

Fine pitch interconnection : min. 15㎛ gap for COF application Minimum connecting area of bump: 1500㎛2.
High reliability and stable adhesion property on 2 layer PI film.

Characteristics
Item TCF7040/41 Series
Pitch size Line ㎛ (㎛2) 1500㎛2
Space 15
Conductiveparticle Type - Au/Ni/Polymer
Size 4
Density pcs/㎜2 40000
Main-bonding condition Temp. 190±10
Time sec. 5~10
Pressure MPa 40~100 (per bump area of IC)