• FeaturesFine pitch interconnection : 50㎛ pitch for TFT-LCD, color STN, EL, High adhesion, high reliability, void-free bonding, and repairable by common solvents.Applicable for fine pitch OLB with shorter bonding times. |
Item | TSB21000 Series | TSC3000 Series | TSC5300 Series | ||
---|---|---|---|---|---|
Pitch size | Line | ㎛ (㎛2) | 50 | 25 | |
Space | ㎛ | 50 | 25 | ||
Conductiveparticle | Type | - | Au/Ni/Polymer | ||
Size | ㎛ | 10 | 4/5 | 5 | |
Density | pcs/㎜2 | 800 | 5000/4500 | 5500 | |
Main-bonding condition | Temp. | ℃ | 190±10 | 190±10 | 165±15 |
Time | sec. | ≥8 | ≥7 | ≥5 | |
Pressure | MPa | 1.5~2.0 | 2~3 | 2~3 |