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Specification of thermal curing type adhesives
▣ High adhesive strength after curing(>200kgf/㎠)▣ High elastic modulus(>2.5GPa) & high Tg(~125℃)
▣ Excellent stability in room temperature
| Application | UNDERFILL-PACKAGING | UNDERFILL- MODULE &COF | PCB REWORK | HOUSING ATTACH | ||
|---|---|---|---|---|---|---|
| Item | Test method | MRH0310N | MRH0110U | MRH0312L | MRH0711E | |
| Appearance | Uncured | naked eye | Black viscous liquid | Black viscous liquid | Green viscous liquid | Black viscous liquid |
| Cured | naked eye(@ surface) | No blisters and cracks | No blisters and cracks | No blisters and cracks | No blisters and cracks | |
| Viscosity | Rheometer(@25℃) | 14,000cPs | 600 ~ 900cPs | 19,500cPs | 35,000cPs | |
| Thixotropic Index | 1.3 | 1.0 ~ 1.1 | 1.6 | 5.1 | ||
| Gelation time | @ Tack free | 80 ± 10 s | 80 ± 10 s | 90 ± 10 s | - | |
| Adhesion strength | Shear strength | >270kgf/㎠(Die shear) | 336.6kgf/㎠ | 350kgf/㎠ | 3.2kgf/㎠(LCP/ FPCB) | |
| Modulus | DMA(@30℃) | 3.2 GPa | 2.4 GPa | 2.7GPa | 0.06GPa | |
| Tg | TMA | 130℃ | 126℃ | 127℃ | 100℃ | |
| CTE | α’(ppm/℃) | 50 ppm/℃ | 60 ppm/℃ | 55 ppm/℃ | 68 ppm/℃ | |
| α’’(ppm/℃) | 175 ppm/℃ | 195 ppm/℃ | 190 ppm/℃ | 1187 ppm/℃ | ||
