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• Features- Low Temperature- Waterproof, - Pb Free |
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| Item | TGP5010 Series |
TSB20522F Series |
TCM5022 Series |
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|---|---|---|---|---|---|---|
| Pitch size | Line | ㎛ | 75 | 125 | 125 | |
| Space | ㎛ | 75 | 125 | 125 | ||
| Conductiveparticle | Type | - | Au/Ni/Polymer | Au/Ni/Polymer + Metal | ||
| Size | ㎛ | 10 | 20 + 8 | |||
| Density | Pcs/mm² | 800 | 200 &500 | 200 &350 | ||
| Main-bonding condition | Temp. | ℃ | 140 ~ 200 | 180 ~ 200 | 130 ~ 180 | |
| Time | sec. | ≥ 4 | ≥7 | ≥6 | ||
| Pressure | MPa | 1.5 ~ 2.5 | 1.5 ~ 2.5 | 1 ~ 3 | ||
