product photo |
• FeaturesMinimum connecting area of bump: 1500 μm2.High reliability and stable adhesion property on FR4 & Ceramic |
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Item | TFA220 Series | ||
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Pitch size | Line | ㎛ (㎛2) | 1500㎛2 |
Space | ㎛ | 15 | |
Conductiveparticle | Type | - | |
Size | ㎛ | 3/5 | |
Density | pcs/㎜2 | 40000/4500 | |
Main-bonding condition | Temp. | ℃ | 180±10 |
Time | sec. | ≥15 | |
Pressure | MPa | 40~100 (per bump area of IC) |