• FeaturesFine pitch interconnection : min. 15㎛ gap for COF application Minimum connecting area of bump: 1500㎛2.High reliability and stable adhesion property on 2 layer PI film. |
Item | TCF7040/41 Series | ||
---|---|---|---|
Pitch size | Line | ㎛ (㎛2) | 1500㎛2 |
Space | ㎛ | 15 | |
Conductiveparticle | Type | - | Au/Ni/Polymer |
Size | ㎛ | 4 | |
Density | pcs/㎜2 | 40000 | |
Main-bonding condition | Temp. | ℃ | 190±10 |
Time | sec. | 5~10 | |
Pressure | MPa | 40~100 (per bump area of IC) |