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Large size LCD panel [OLB]

• Features

Fine pitch interconnect : 20 μm fine pitch for TFT-LCD, color STN, EL, High adhesion, high reliability, void-free bonding, and repairable by common solvents.
Low bonding temperature and quick bonding time.

Characteristics
Item TSC5330/40 Series EMA7870 Series
Pitch size Line ㎛ (㎛2) 6 10
Space 14 10
Conductiveparticle Type - Au/Ni/polymer or Ni/Polymer
Size 3/4 3
Density pcs/㎜2 5500/7000 6000
Main-bonding condition Temp. 150±20 170±20
Time sec. ≥4 ≥4
Pressure MPa 3~5 3~5
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